Available in the same configurations as the commercial style the military variant of the high density range is fitted with a Diallylphthalate (DAP) contact block this increasing the temperature operating range to -65 degrees to + 150degrees C. The connectors meeting the requirements of MIL-C-24308 are supplied complete with the necessary colour code Crimp.

To meet the ever increasing demands of the electronics industry for higher contact packing densities in interface connectors, IQC are now able to offer the full range of interface configurations. Whilst most suppliers limit their range to 15, 26, 44 and 62 ways we are able to also supply in 78 and 104 ways. The Thermoplastic (PBT) contact blocks enable the connector to operate within a temperature range of -55 degrees to + 125 degrees C. Metal clips within the contact block ensure contact retention.

In terms of their outside dimensions the shells of the high density D Sub series are the same as for the well known standard D Sub connectors, but the number of contacts has been considerably increased. Due to the higher contact density of 15, 26, 44, 62 and 78 positions, this series is ideally suited for the most modern applications in data transmission and telecommunications, as well as in measurement, regulation and control devices.

In terms of their outside dimensions the shells of the high density D Sub series are the same as for the well known standard D Sub connectors, but the number of contacts has been considerably increased. Due to the higher contact density of 15, 26, 44, 62 and 78 positions, this series is ideally suited for the most modern applications in data transmission and telecommunications, as well as in measurement, regulation and control devices.

In terms of their outside dimensions the shells of the high density D Sub series are the same as for the well known standard D Sub connectors, but the number of contacts has been considerably increased. Due to the higher contact density of 15, 26, 44, 62 and 78 positions, this series is ideally suited for the most modern applications in data transmission and telecommunications, as well as in measurement, regulation and control devices.