Solder Bucket
Whilst the standard ranges of D-sub miniature connectors are manufactured with contact blocks molded in thermoplastic, this limits the operating temperature range to a maximum of 125C. For applications where a higher operating temperature is required, connectors are available with D.A.P contact blocks. This being high temperature polyester (to UL 48036) which increases the operating temperature range to 150C.
Right Angled PCB
This connector is ideal for applications that require optimization of space while improving overall shielding. Mixed Layout accomplishes this by combining multiple interconnection types into one fully shielded product, decreasing the number I/O interfaces and reducing the possibility of EMI/RFI leakage.
Straight PCB
This connector is ideal for applications that require optimization of space while improving overall shielding. Mixed Layout accomplishes this by combining multiple interconnection types into one fully shielded product, decreasing the number I/O interfaces and reducing the possibility of EMI/RFI leakage.
Solder Bucket
This connector is ideal for applications that require optimization of space while improving overall shielding. Mixed Layout accomplishes this by combining multiple interconnection types into one fully shielded product, decreasing the number I/O interfaces and reducing the possibility of EMI/RFI leakage.
Wire Wrap
This connector is ideal for applications that require optimization of space while improving overall shielding. Mixed Layout accomplishes this by combining multiple interconnection types into one fully shielded product, decreasing the number I/O interfaces and reducing the possibility of EMI/RFI leakage.
Right Angled PCB
This connector is ideal for applications that require optimization of space while improving overall shielding. Mixed Layout accomplishes this by combining multiple interconnection types into one fully shielded product, decreasing the number I/O interfaces and reducing the possibility of EMI/RFI leakage.
Straight PCB
This connector is ideal for applications that require optimization of space while improving overall shielding. Mixed Layout accomplishes this by combining multiple interconnection types into one fully shielded product, decreasing the number I/O interfaces and reducing the possibility of EMI/RFI leakage.
Solder Bucket
This connector is ideal for applications that require optimization of space while improving overall shielding. Mixed Layout accomplishes this by combining multiple interconnection types into one fully shielded product, decreasing the number I/O interfaces and reducing the possibility of EMI/RFI leakage.
Commercial
To reduce overall assembly time, this standard range of D-sub miniature connectors is available with crimp terminated signal contacts. The contacts are available in either machine turned or stamped variants, the letter being supplied either loose or bandolier mounted. The contacts are available in variants to suit conductor sizes ranging from AWG 18 to 28.
Suitable hand or automatic tooling detail is available on request.
